COMPLETED RESEARCH
ALTERNATIVE STRUCTURAL FRAMING SYSTEMS IN MICROELECTRONICS FACILITY CONSTRUCTION
by
Colby A. Robinson
ABSTRACT
Increasingly, owners of semiconductor manufacturing facilities desire new wafer fabrication facilities constructed in less time, for less money, and at higher quality levels. The structural framing systems that support wafer fabrication facility requirements are instrumental in determining how quickly a facility can be constructed and utilized. This research evaluated concrete versus steel for structural framing systems to determine the impact of cost and schedule of defined alternatives and to develop a cost model methodology based on implementation of alternative delivery systems.
The literature review discusses the advantages and disadvantages of using alternative structural materials for wafer fabs. A baseline structure was developed for time and cost analysis in this research. An industry survey and an informal survey were used to collect time and cost data from cleanroom construction industry professionals to analyze how structural materials affect project schedule and cost. All data collected was based on the model structure developed in this research project. Case studies of two existing semiconductor facilities were also utilized to augment the survey data.
Four structural alternatives of the baseline structure were selected for cost analysis. The analysis assessed the cost trade-offs attained for the four different structural systems. Furthermore, the analysis was developed into a cost model made to be adjustable for further changes to structural material prices, structural material quantities, labor rates, structural crew sizes, and structural crew productivity rates. The research provides a research-based decision aid that will assist in the optimization of the design and construction of structural framing systems for semiconductor manufacturing facilities while considering the impact of those decisions on the construction schedule.
